Platinum helps silicon wafer cleaning apparatus 21st September 2006

The development of equipment which can be used to clean silicon wafer has been achieved with the help of a platinum coating.

Scientists in Japan have created a rotation silicon wafer cleaning device which can deliver drying and hydrogen termination treatment to the outer surface of a silicon wafer.

The experts are hoping that the design will help them to improve the stability of a silicon wafer.

A statement from the US Patent and Trademark Office explained that the device is designed to raise stability by "providing a better hydrogen termination on the silicon wafer after completion of chemical and pure water cleaning treatments".

The technology uses a platinum coating film on a hydrogen radical formation apparatus to form hydrogen radical at the gas contacting part, where mixed gas containing hydrogen radical and inactive hydrogen, which is gushed out onto the rotating silicon wafer after cleaning is completed.

Ÿ Adfero Ltd



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