Dow Corning is ready to showcase its new low platinum coating products at the Labelexpo Americas 2008.

Known as the Advantage Series, they provides solventless release, as well as good anchorage and converting properties.

The latest products require low levels of platinum and offer the ability to use a wider range of substrates.

The new range is allowing the firm to be less vulnerable against swings in platinum prices and it can also lower silicone costs.

Also displayed at the event will be the firm's cost-effective emulsion release coating series and a number of innovative coating solutions for many different film types and grades.

The Labelexpo Americas is the leading event for the label and product decoration industries across the US and the Americas and it takes place this September in Chicago.

Meanwhile, the firm is considering a "handful" of sites for a new plant expansion to produce materials used in solar panels and electronics.



Source:

Dow Corning to Showcase Low-Platinum Solventless Release Coatings, 29/07/08
http://www.azom.com/News.asp?NewsID=13125

Clarksville eyed for Dow Corning plant expansion, 29/07/08
http://www.bizjournals.com/nashville/stories/2008/07/28/daily24.html